TOP > Products > IT Components & Materials > IC LEAD FRAME MATERIALS / IC LEAD WIRE MATERIALS

IT Components & Materials

IC LEAD FRAME MATERIALS / IC LEAD WIRE MATERIALS

Overview

Sealing materials are used widely in the production of electron tubes, transistors, integrated circuits, cathode ray tubes, etc.
Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are applied. In addition, sections in contact with glass and ceramics must have excellent mechanical strength.

Products Catalogs (PDF file)

Inquiries
Electric Materials Business Unit, Specialty Steel Company
TEL : +81-3-5765-4370
Inquiry Form

← Page Back

↑ Page Top

SitemapHelp
COPYRIGHT © 1997 - 2012 Hitachi Metals, Ltd. ALL RIGHTS RESERVED.