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IT Components & Materials
IC LEAD FRAME MATERIALS / IC LEAD WIRE MATERIALS
Overview
Sealing materials
are used widely in the production of electron tubes, transistors,
integrated circuits, cathode ray tubes, etc.
Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are applied. In addition, sections in contact with glass and ceramics must have excellent mechanical strength.
Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are applied. In addition, sections in contact with glass and ceramics must have excellent mechanical strength.
Products Catalogs (PDF file)
| Product | File Size |
|---|---|
| Product Catalog(YSS COLD ROLLED STRIPS) | 1,357KB  |
