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Computers & Semiconductor IC Products

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LEAD-FREE SOLDER BALLS

Overview

Using new manufacturing techniques, Hitachi Metals has developed inexpensive, high-quality lead-free solder balls for ball-grid-array (BGA) and chip-scale-package (CSP) applications.

Proprietary Features

High-speed droplet cutting enables accelerated production.
As no oil is needed in the manufacturing process, surface oxidation can be controlled.
Permits only minor variations in composition

Solder Ball Manufacturing Methods

Conventional Method:
Oil-based Granulation

Uniform Droplet Spray Method

	Solder materials must undergo processing to make fine-wire and foil solders.
	It requires a time-consuming oil-removal process and results in inferior surface properties.
	Production speed is slow.

	Facilitates use of solder materials that are difficult to form into fine-wire and foil solders.
	Oil-free process; limits surface oxidation
	Virtually no variation in surface composition

Range of Production Sizes

Diameter: 60~760μm

Applications

This method enables the production of balls from all basic lead-free solder materials, including Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Bi, Sn-Cu and Sn-Zn.

Prior to Adoption Warning

• Cautionary Items

-Solder balls cannot be handled with bare hands.

-Use immediately after opening

• Usage Restrictions

-Solder balls may become deformed or exhibit defects when subjected to extreme stress or vibrations.

-Blackening may occur if solder materials are kept in the ball mounter for extended periods.

• Application Environment

-Small solder balls should not be used in extremely humid or dry conditions.

-Balls should be used only in a clean room.

Inquiries

Electric Materials Business Unit, Specialty Steel Company TEL : +81-3-5765-4370
Inquiry Form

Hitachi Metals, Ltd.