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Computers & Semiconductor IC Products
INSULATING SUBSTRATE Si3N4 for POWER SEMICONDUCTOR MODULES
Overview
By
assigning high thermal conductivity to high-strength, high-pliancy
silicon nitride (Si3N4)
ceramics, we have improved thermal shock resistance and heat-resistant
fatigue as well as greatly increased the reliability of semiconductor
modules. Furthermore, we have been able to realize a new module structure
that was not possible with conventional aluminum and aluminum nitride.
Proprietary Features
We
have succeeded in developing materials of both improved strength
and heat conductivity, attributes which usually involve a trade-off.
At 100W/m.K x 1,000 MPa (research level), we have achieved the world's
highest standard.
Direct Benefits
(1) Conventionally, aluminum
and aluminum nitride have been used in the insulation boards
of power semiconductor modules, but the mechanical strength
is low and there are limitations with the structural design
of the module itself. Figure 1 shows the complicated construction.
Figure 1: Conventional Structure
(2) By using the newly developed high-strength, highly heat conductive Si3N4 in the insulation board, we have been able to simplify the module structure, as shown in Figure 2. It has become possible to affix a thick Cu Wiring board, thereby lowering thermal resistance. The construction has been further simplified by eliminating the heat dissipation board, resulting in cost reductions.
Figure 2: New Module Structure (Simplified)
Figure 1: Conventional Structure
(2) By using the newly developed high-strength, highly heat conductive Si3N4 in the insulation board, we have been able to simplify the module structure, as shown in Figure 2. It has become possible to affix a thick Cu Wiring board, thereby lowering thermal resistance. The construction has been further simplified by eliminating the heat dissipation board, resulting in cost reductions.
Figure 2: New Module Structure (Simplified)
Associated Benefits
Fields of Applications:
1. Can be widely used as a structural material where thermal shock resistance and heat-resistant fatigue are required.
2. Its high degree of purity makes it suitable for use as a semiconductor manufacturing device material.
1. Can be widely used as a structural material where thermal shock resistance and heat-resistant fatigue are required.
2. Its high degree of purity makes it suitable for use as a semiconductor manufacturing device material.
Applications
- Insulation boards for Peltier elemental modules
- Semiconductor manufacturing equipment material
- Heat-resistant structural material
Inquiries
Corporate Sales Administration Center TEL : +81-3-5765-4098
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