Computers & Semiconductor IC Products
METAL INJECTION MOLDING (MIM) COBALT OPTICAL COMMUNICATIONS PARTS

Figure 1: Samples of MIM Cobalt Optical Communications Parts
Overview

Figure 2: MIM Process Flowchart
Currently, around the world efforts
are being made to complete the fiber optic network. Accompanying
this development, there has been a surge in demand for fiber-optic
related products made from cobalt materials offering low thermal
expansion. In particular, the complex-shaped packages have produced
a high demand for low-cost, metal-powder injection molded products
over conventional machine-assembled items. Our products have been
created drawing on the Company's nearly 10-year track record with
MIM technology.
The MIM process, as shown below in the flowchart appearing in Figure 2, is a manufacturing process for mass-producing complicated three-dimensional objects in near-net shapes.
The MIM process, as shown below in the flowchart appearing in Figure 2, is a manufacturing process for mass-producing complicated three-dimensional objects in near-net shapes.
Features
1. Molds and Dimensional Precision
Compared with conventional machining products, our products are low-cost, and, as Figure 1 shows, enable the production of complicated three-dimensional forms of near-net shaped sintered bodies. Furthermore, the dimensional precision is ±0.5%.
2. Special Features
(1) Low Thermal Expansion
With almost the same thermal expansion coefficient as molten manufacturing materials, it is ideal as an adhesive (See Chart 1.).
(2) Highly Airtight
The relative density exceeds 96%, which is an adequate degree of airtightness for packaging applications.
(3) High Purity
Due to its high density, it has few holes, as seen below (Figure 3), and is well-suited to metal plating.
Compared with conventional machining products, our products are low-cost, and, as Figure 1 shows, enable the production of complicated three-dimensional forms of near-net shaped sintered bodies. Furthermore, the dimensional precision is ±0.5%.
2. Special Features
(1) Low Thermal Expansion
With almost the same thermal expansion coefficient as molten manufacturing materials, it is ideal as an adhesive (See Chart 1.).
Chart 1: Thermal Expansion Coefficient
| Unit: 10-6/K | ||
| @ | 30~400°C | 30~800°C |
| MIM sintered items | 4.20~4.80 | 9.60~10.20 |
| Molten manufacturing materials(ASTM F15) | 4.60~5.20 | (10.4) |
| ( ) refers to ASTM F15, given as an example. | ||
(2) Highly Airtight
The relative density exceeds 96%, which is an adequate degree of airtightness for packaging applications.
(3) High Purity
Due to its high density, it has few holes, as seen below (Figure 3), and is well-suited to metal plating.
Figure 3: Microstructure


Inquiries
Hitachi Metals Precision, Ltd. TEL : +81-3-5765-3078
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