Insulating Substrate Si3N4 for Power Semiconductor Modules


By assigning high thermal conductivity to high-strength, high-pliancy silicon nitride (Si3N4) ceramics, we have improved thermal shock resistance and heat-resistant fatigue as well as greatly increased the reliability of semiconductor modules. Furthermore, we have been able to realize a new module structure that was not possible with conventional aluminum and aluminum nitride.

We propose a method to use materials tailored to your company.

Proprietary Features

We have succeeded in developing materials of both improved strength and heat conductivity, attributes which usually involve a trade-off. At 130kW/m.kXMpa, we have achieved the world's highest standard.

Direct Benefits

Associated Benefits

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