Insulating Substrate Si3N4 for Power Semiconductor Modules


By assigning high thermal conductivity to high-strength, high-pliancy silicon nitride (Si3N4) ceramics, we have improved thermal shock resistance and heat-resistant fatigue as well as greatly increased the reliability of semiconductor modules. Furthermore, we have been able to realize a new module structure that was not possible with conventional aluminum and aluminum nitride.

Proprietary Features

We have succeeded in developing materials of both improved strength and heat conductivity, attributes which usually involve a trade-off. At 130kW/m.kXMpa, we have achieved the world's highest standard.

Direct Benefits

Associated Benefits

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